Senior Packaging Technical Engineer - Hardware

NVIDIA is seeking a Senior Packaging Technical Engineer to join our team. As a Senior Packaging Technical Engineer, you will be responsible for defining the chip pad ring, substrate interconnect scheme, and leading the package layout design process.

You will collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design Engineers and Managers. Your goal will be to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.

To be successful in this role, you will need:

• BSEE or equivalent experience
• Minimum of 8+ years in board/system design, with experience in package design preferred
• Good understanding of transmission line theory, power delivery, and signal integrity
• Strong programming and scripting skills in Perl, Python, Tcl, with Cadence Skill and EXCEL familiarity helpful
• Ability to work with minimal supervision and solve complex technical problems

NVIDIA offers competitive salaries and a generous benefits package.