# Senior Packaging Technical Engineer - Hardware

**Company**: NVIDIA
**Location**: Bengaluru, India
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/India-Bengaluru/Senior-Packaging-Technical-Engineer---Hardware_JR2012324?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_fb1ea4c3-c90

## Description

We are seeking a Senior Packaging Technical Engineer to join our team.

Responsibilities include:

- Defining the chip pad ring, substrate interconnect scheme, and leading the package layout design process.

- Collaborating with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design Engineers and Managers.

- Defining a chip floor plan, pad ring, substrate, and ball out to implement a robust world-class electrical package.

- Communicating effectively with various teams throughout the company.

Requirements:

- BSEE or equivalent experience.

- Minimum of 8+ years in board/system design, with experience in package design preferred.

- Good understanding of transmission line theory, power delivery, and signal integrity.

- Strong programming and scripting skills in Perl, Python, Tcl, and Cadence Skill, with Excel familiarity helpful.

- Ability to work with minimal supervision and enthusiasm for solving complex technical problems.

NVIDIA offers competitive salaries and a generous benefits package.

## Skills

### Required
- BSEE
- board/system design
- package design
- transmission line theory
- power delivery
- signal integrity
- Perl
- Python
- Tcl
- Cadence Skill
- Excel

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Source: [Apply at nvidia.wd5.myworkdayjobs.com](https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/India-Bengaluru/Senior-Packaging-Technical-Engineer---Hardware_JR2012324?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)