# Component Engineering Technical Leader

**Company**: Cisco
**Location**: Taipei
**Work arrangement**: onsite
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://cisco.wd5.myworkdayjobs.com/en-US/Cisco_Careers/job/Taipei-Taiwan/Component-Engineering-Technical-Leader_2016630?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_f4558012-d47

## Description

You will be part of Cisco's Technology and Quality Group in Supply Chain Operations, contributing to the development, road-mapping, and implementation of sophisticated end-to-end thermal solutions for Cisco's products.

**Responsibilities:**

- Develop and lead system thermal technology roadmap in partnership with suppliers and internal partners to meet Cisco products' needs.

- Develop quality strategy for liquid cooling manufacturing process.

- Investigate innovative liquid cooling solutions for hardware systems in large scale.

- Derive tradeoffs in thermal performance of different package design elements and chip thermal gradients from experimental test data.

- Develop test plans and qualification requirements to ensure mechanical and manufacturing adaptability of thermal cooling solutions.

- Engage with external vendors on design, test, and production.

- Develop and publish case studies/technical papers describing thermal analysis of cooling systems.

- Establish parameters for thermal design/testing, correlation of design/test results to model predictions.

- Contribute to analytical and numerical models using Computational Fluid Dynamics tools.

- Drive supplier ecosystem development, participate in industry consortia, conferences, and collaborate with academia and strategic partners.

- Integrate Circuit Thermal simulation and testing and system level cooling technologies.

- Mechanical design validation and testing for electronic assemblies.

- Coordinate Circuit Packaging technologies.

- Component and system reliability analysis.

**Requirements:**

- BS in Mechanical/Thermal or Chemical Engineering.

- 10+ years' experience in design, simulation, and testing of thermal solutions for electronic devices and systems.

- Extensive experience with advanced air-cooling technologies.

- Experience with liquid cooling and/or immersion cooling.

**Preferred Qualifications:**

- MS or PhD in Mechanical or Chemical Engineering or related field.

- 15+ years of relevant proven experience in microelectronics thermal cooling.

- Experience with JEDEC JESD 51 thermal testing standards.

- Experience with Thermal Interface Material Thermal Conductivity Testing procedures and microelectronics packaging design and manufacturing process.

## Skills

### Required
- Mechanical Engineering
- Thermal Engineering
- Chemical Engineering
- Computational Fluid Dynamics
- Thermal Interface Material
- Microelectronics Packaging

### Nice to have
- JEDEC JESD 51
- Thermal Interface Material Thermal Conductivity Testing
- Microelectronics Packaging Design and Manufacturing

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Source: [Apply at cisco.wd5.myworkdayjobs.com](https://cisco.wd5.myworkdayjobs.com/en-US/Cisco_Careers/job/Taipei-Taiwan/Component-Engineering-Technical-Leader_2016630?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)