# IC Packaging Engineer

**Company**: NVIDIA
**Location**: Yokneam, Israel
**Work arrangement**: onsite
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Israel-Yokneam/IC-Packaging-Engineer_JR2015252?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_d8b2f4e0-e71

## Description

NVIDIA, a world-class technology company, is seeking a passionate Package Engineer to join our team in Israel. As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages.

**What you will be doing:**

- Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.

- Review manufacturability readiness at each milestone.

- Work with world leading vendors to develop highly challenging packaging solutions.

- Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products

- Collaborating with world-leading vendors to develop highly ambitious packaging solutions

- Thriving in a dynamic and challenging environment

- Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.

- Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.

- Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.

**What we need to see:**

- BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.

- 2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.

- Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.

- Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.

- High awareness for quality, robustness, and manufacturability.

- High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.

- Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.

- Curious and creative problem solver, well organized and multi-tasker.

**Ways to stand out of the crowd:**

- Hands-on FEA mechanical simulation experience - Advantage

- Team / Group / Project management - Advantage

- Experience with manufacturing environment and manufacturing statistics tools

- Background in engineering semiconductor manufacturing processes

## Skills

### Required
- Microelectronics packaging
- ASIC design
- DFM
- Manufacturing processes
- Material properties
- Metrology tools
- Leadership skills
- Project management

### Nice to have
- FEA mechanical simulation
- Team management
- Manufacturing environment
- Semiconductor manufacturing processes

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Source: [Apply at nvidia.wd5.myworkdayjobs.com](https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Israel-Yokneam/IC-Packaging-Engineer_JR2015252?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)