# Mechanical Engineer, Thermal & Packaging

**Company**: Hewlett Packard Enterprise
**Location**: Bengaluru, Karnātaka
**Work arrangement**: onsite
**Experience**: mid
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Bengaluru-Karntaka-India/Mechanical-Engineer--Thermal---Packaging_1213942-2?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_cea2e10b-e72

## Description

We are seeking a Mechanical Engineer, Thermal & Packaging to join our team in Bengaluru, Karnātaka, India. As a Mechanical Engineer, Thermal & Packaging, you will design, analyze, develop, modify, and evaluate mechanical and thermal hardware, electronic enclosures, and production tooling.

Responsibilities:

- Design, analyze, develop, modify, and evaluate mechanical and thermal hardware, electronic enclosures, and production tooling.

- Develop and implement test plans for new and existing designs, including tolerance analysis, form-fit-function, shock and vibration, EMI, safety, reliability, acoustics, fan curves, and system power measurements.

- Conduct feasibility studies, design margin analysis, validation, and empirical testing.

- Use CFD analysis and thermal mockups to validate thermal solutions.

- Collaborate with management, internal teams, and external development partners on design status, project progress, and issue resolution.

- Lead mechanical engineering project teams to deliver reliable, cost-effective, and high-quality solutions.

- Represent the mechanical and thermal engineering team throughout complex product development projects.

- Provide technical guidance and mentoring to junior engineers.

Requirements:

- Bachelor's or Master's degree in Mechanical Engineering.

- Typically 4–6 years of relevant mechanical engineering experience.

- Proficiency in ProEngineer (ProE/Creo) or other 3D CAD software.

- Strong understanding of electronics packaging and mechanical hardware design.

- Experience designing sheet metal and plastic components, including production tooling and manufacturing processes.

- Knowledge of CFD, thermal simulation, and thermal mockups for thermal validation.

- Strong analytical, problem-solving, and design validation skills.

- Excellent written and verbal communication skills in English and Kannada.

- Ability to communicate product architectures and design proposals, negotiate technical options with management, and coordinate cross-functional teams.

Benefits:

- Comprehensive suite of benefits that supports physical, financial, and emotional wellbeing.

- Investment in your career through specific programs catered to helping you reach your career goals.

- Unconditionally inclusive work environment that celebrates individual uniqueness.

## Skills

### Required
- Mechanical Engineering
- Thermal Engineering
- Packaging
- ProEngineer
- CFD
- thermal simulation
- 3D CAD

---

Source: [Apply at hpe.wd5.myworkdayjobs.com](https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Bengaluru-Karntaka-India/Mechanical-Engineer--Thermal---Packaging_1213942-2?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)