# Mechanical/Hardware Engineer (Thermal)

**Company**: Hewlett Packard Enterprise
**Location**: Chippewa Falls, Wisconsin
**Work arrangement**: onsite
**Experience**: mid
**Job type**: full-time
**Salary**: $74,000 - $170,300
**Category**: Engineering
**Industry**: Technology

**Apply**: https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Chippewa-Falls-Wisconsin-United-States-of-America/Mechanical-Hardware-Engineer--Thermal-_1213853-2?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_bc2c21e9-492

## Description

We are seeking a Mechanical/Hardware Engineer (Thermal) to join our team. As a Mechanical/Hardware Engineer (Thermal), you will be responsible for designing, analyzing, developing, modifying, and evaluating materials, mechanical systems, equipment, and packaging.

You will conduct feasibility, design margin, and validation analysis and empirical testing on new and modified designs. You will lead and/or assist in architecture development and assessment, evaluate reliability of materials, properties, designs, and techniques used in production.

Your primary focus will be on addressing thermal challenges in support of server designs. You will develop and deliver cost-effective cooling solutions that are best-in-class thermally and acoustically. Your responsibilities will include:

- Leading multiple project teams of other mechanical hardware engineers and internal and outsourced development partners

- Managing and expanding relationships with internal and outsourced development partners

- Reviewing and evaluating designs and project activities for compliance with technology and development guidelines and standards

- Providing domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities

- Driving innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization

- Providing guidance and mentoring to less-experienced staff members

You will need to have a strong understanding of electronics packaging, designing sheet metal and plastic parts and associated production tooling and processes, and proficiency with CFD and thermal mockups to validate thermal solutions.

## Education and Experience

- Bachelor's or Master's degree in Mechanical Engineering

- Typically 2-4 years of experience

## Knowledge and Skills

- Using ProEngineer or other 3D CAD software as a mechanical design tool

- Ability to apply analytical and problem-solving skills

- Designing sheet metal and plastic parts and associated production tooling and processes

- Using CFD and thermal mockups to validate thermal solution

- Strong written and verbal communication skills

- Mastery in English and local language

## Benefits

We offer a comprehensive suite of benefits that supports the physical, financial, and emotional wellbeing of our team members and their loved ones.

## What We Can Offer You

- Health & Wellbeing

- Personal & Professional Development

- Unconditional Inclusion

## Job Level

TCP_02

## Salary

The expected salary/wage range for this position is $74,000 - $170,300 per year in Wisconsin. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level.

## Skills

### Required
- ProEngineer
- 3D CAD
- mechanical design
- analytical skills
- problem-solving skills
- CFD
- thermal mockups
- communication skills

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Source: [Apply at hpe.wd5.myworkdayjobs.com](https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Chippewa-Falls-Wisconsin-United-States-of-America/Mechanical-Hardware-Engineer--Thermal-_1213853-2?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)