# ASIC Engineering Technical Leader- IC Package Design

**Company**: Cisco
**Location**: Bangalore
**Work arrangement**: hybrid
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://cisco.wd5.myworkdayjobs.com/en-US/Cisco_Careers/job/Bangalore-India/ASIC-Engineering-Technical-Leader_2020634?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_b7b62f62-814

## Description

Join the Package Design Team at Cisco Silicon One in India, a group leading the way in developing Cisco's groundbreaking silicon solutions for next-generation networking.

As a collaborative team at the center of Cisco's silicon development, we design and optimize advanced package solutions for some of the industry’s most sophisticated ASICs.

This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative.

As a lead engineer, you will drive the entire package design process,from planning and optimization to execution,ensuring the delivery of high-speed, robust, and scalable solutions for global networks.

You will mentor engineers, define strategies, and collaborate across multi-functional teams to accelerate the creation of industry-leading silicon packages.

Responsibilities:

- Lead package design tasks, planning and driving schedules from concept through implementation

- Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance and manufacturability

- Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency

- Work closely with layout editors to deliver high-quality package designs aligned with interface requirements

- Enhance design methodologies and partner with vendors to improve product quality and efficiency

- Drive innovation in package solutions for Cisco’s next-generation ASICs

Minimum Qualifications:

- Bachelor’s or Master’s degree in Electrical Engineering or a related field

- Strong understanding of high-speed signal design, power distribution networks (PDN), and PCB design

- Experience with industry-standard EDA tools for layout and design

Preferred Qualifications:

- Experience in ASIC package design, including pinout optimization and high-speed routing

- Knowledge of silicon floor planning, SI, and PI considerations

- Proven ability to lead design improvements and coordinate with stakeholders

- Firsthand experience with testing and measurement equipment (oscilloscopes, TDR/VNA analyzers)

- Excellent verbal and written communication skills in English

- Scripting experience (Python, Perl, TCL, shell programming) is highly valuable

- Experience in leading a team of designers

## Skills

### Required
- Electrical Engineering
- high-speed signal design
- power distribution networks
- PCB design
- EDA tools

### Nice to have
- ASIC package design
- pinout optimization
- high-speed routing
- silicon floor planning
- signal integrity
- power integrity
- testing and measurement equipment
- scripting
- team leadership

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