# Thermal/Mechanical Engineering Intern

**Company**: Hewlett Packard Enterprise
**Location**: Spring, Texas
**Work arrangement**: hybrid
**Experience**: entry
**Job type**: internship
**Salary**: Hourly Salary USD 35.00 - 41.00
**Category**: Engineering
**Industry**: Technology

**Apply**: https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Spring-Texas-United-States-of-America/Thermal-Mechanical-Engineering-Intern_1213398?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_b6cbeba4-a71

## Description

We are seeking a motivated Thermal/Mechanical Engineering Intern to support the design, analysis, testing, and validation of next-generation server hardware.

Working alongside experienced mechanical, thermal, electrical, firmware, and system engineers, the intern will help develop reliable cooling and mechanical solutions for compute-intensive platforms containing CPUs, GPUs, memory, storage, power supplies, and high-speed I/O devices.

**Responsibilities:**

- Support the mechanical and thermal development of rack-mount server platforms, subsystems, and components.

- Assist with the design and evaluation of heat sinks, fans, air ducts, cold plates, brackets, sheet-metal parts, and other cooling or structural hardware.

- Build and instrument server prototypes for thermal, airflow, acoustic, vibration, and mechanical testing.

- Measure component temperatures, system airflow, pressure, power, and environmental conditions using laboratory equipment and data-acquisition tools.

- Execute documented test plans, maintain accurate test records, analyze results, and summarize findings in clear technical reports.

- Support workload and stress testing of CPUs, GPUs, DIMMs, drives, power supplies, and other heat-generating components.

- Perform engineering calculations and assist with CAD, tolerance analysis, thermal modeling, CFD, or FEA under the guidance of senior engineers.

- Investigate test anomalies and prototype issues using structured troubleshooting and root-cause methods.

- Participate in design reviews and collaborate with electrical, firmware, manufacturing, reliability, and supplier teams.

- Research emerging server-cooling technologies, materials, and design practices, including air cooling and direct liquid cooling.

- Follow laboratory safety procedures, maintain an organized workspace, and contribute to continuous improvement of test methods and documentation.

**Education & Experience:**

- Currently pursuing a bachelor's or master's degree in Mechanical Engineering, Aerospace Engineering, or a related technical field.

**Knowledge & Skills:**

- Completed coursework in heat transfer, thermodynamics, fluid mechanics, statics, mechanics of materials, or mechanical design.

- Fundamental understanding of conduction, convection, pressure drop, airflow, and mechanical load paths.

- Ability to apply engineering principles to practical problems and communicate results clearly.

- Basic proficiency with spreadsheets and technical presentations.

- Strong attention to detail, organization, curiosity, and willingness to work hands-on in a laboratory environment.

- Ability to collaborate effectively in a multidisciplinary engineering team.

**Benefits:**

- Comprehensive suite of benefits that supports physical, financial, and emotional wellbeing.

- Investment in career development and growth.

- Unconditional inclusion and celebration of individual uniqueness.

## Skills

### Required
- Mechanical Engineering
- Aerospace Engineering
- heat transfer
- thermodynamics
- fluid mechanics
- mechanical design

---

Source: [Apply at hpe.wd5.myworkdayjobs.com](https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Spring-Texas-United-States-of-America/Thermal-Mechanical-Engineering-Intern_1213398?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)