# Sr Staff Advanced Package Design Engineer

**Company**: Synopsys
**Location**: Sunnyvale, California
**Experience**: senior
**Job type**: full-time
**Salary**: $165000-$248000
**Category**: Engineering
**Industry**: Technology
**Ticker**: SNPS
**Wikidata**: https://www.wikidata.org/wiki/Q2303478

**Apply**: https://careers.synopsys.com/job/sunnyvale/sr-staff-advanced-package-design-engineer-19001/44408/101374392656?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_ab4eed75-e2f

## Description

You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges.

You will be collaborating with cross-functional teams during early design stages to optimize and define SIPI performance requirements, including bump mapping and power estimation.

Key responsibilities include:

- Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.

- Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance.

- Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.

- Resolving a wide range of design and integration issues using creative, data-driven approaches.

- Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.

- Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies.

The ideal candidate will have:

- Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).

- Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.

- Expert knowledge of advanced circuit and transmission line theory.

- Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.

- Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).

- Familiarity with both Windows and Linux operating systems.

- Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.

Benefits include:

- Comprehensive medical and healthcare plans

- Time away programs

- Family support

- ESPP

- Retirement plans

- Competitive salaries

## Skills

### Required
- advanced package design
- silicon interposers
- RDL fanout packages
- silicon bridge packages
- multi-physics analysis
- Cadence APD
- Innovus
- Integrity-3DIC
- Synopsys ICC2
- 3DIC Compiler
- Fusion Compiler

### Nice to have
- TSMC
- Intel
- Samsung
- OSAT advanced package technologies

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Source: [Apply at careers.synopsys.com](https://careers.synopsys.com/job/sunnyvale/sr-staff-advanced-package-design-engineer-19001/44408/101374392656?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)