# Applications Engineering, Sr Director (3DIC)

**Company**: Synopsys
**Location**: Hsinchu
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology
**Ticker**: SNPS
**Wikidata**: https://www.wikidata.org/wiki/Q2303478

**Apply**: https://careers.synopsys.com/job/hsinchu/applications-engineering-sr-director-3dic/44408/101631905344?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_a1731e14-7d5

## Description

You will lead the non-Americas AE team for our 3DIC and advanced packaging portfolio at Synopsys, a company that delivers industry-leading silicon design, IP, simulation and analysis solutions, and design services.

Your role involves leading and scaling the non-Americas application engineering team supporting Synopsys' 3DIC and advanced packaging solution portfolio across a growing customer base.

Key responsibilities include:

- Setting the technical strategy for how your AE organization engages customers on complex 3DIC design challenges

- Driving customer discovery, opportunity qualification, and technical sales campaigns that result in design wins and measurable revenue growth

- Building and managing a team of senior application engineers who can operate independently with customers and deliver results

- Partnering with sales, product, and R&D teams to align customer needs with product roadmaps

- Owning customer escalations and technical roadblocks that require senior leadership engagement

The impact you will have includes:

- Scaling Synopsys' presence in high-growth semiconductor markets

- Driving adoption of 3DIC, advanced packaging, and multi-physics solutions in accounts

- Increasing design win rates and customer satisfaction

- Developing the next generation of technical leaders within Synopsys

- Influencing product strategy by bringing customer insights and market trends back to R&D and product teams

Requirements:

- 10+ years in application engineering, technical sales, or customer-facing roles within the EDA or semiconductor industry

- Expertise in digital implementation, 3DIC design construction, and multi-physical analysis

- Proven track record managing geographically distributed teams

- Experience driving new business acquisition, competitive displacement, and technical sales campaigns

- Strong understanding of 3DIC technologies, advanced packaging, and the broader semiconductor design ecosystem

Rewards and benefits include a comprehensive range of health, wellness, and financial benefits.

## Skills

### Required
- 3DIC design
- advanced packaging
- digital implementation
- multi-physical analysis
- technical sales
- team management

### Nice to have
- EDA
- semiconductor industry
- multi-physics solutions

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Source: [Apply at careers.synopsys.com](https://careers.synopsys.com/job/hsinchu/applications-engineering-sr-director-3dic/44408/101631905344?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)