# Principal Mechanical Engineer

**Company**: Hewlett Packard Enterprise
**Location**: Sunnyvale, California
**Work arrangement**: onsite
**Experience**: senior
**Job type**: full-time
**Salary**: Annual Salary USD 140,500 - 285,000
**Category**: Engineering
**Industry**: Technology

**Apply**: https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Sunnyvale-California-United-States-of-America/Principal-Mechanical-Engineer_1214398-2?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_9a5d3fc9-4d6

## Description

We are seeking a Principal Mechanical Engineer to join our team in Sunnyvale, California. As a hands-on individual contributor, you will be responsible for the mechanical design, structural analysis, development, and qualification of complex networking systems from concept through production.

Responsibilities include:

- Developing and owning structural FEA simulation capabilities to support multiple ongoing NPI projects as well as sustaining issues as they arise

- Improving simulation accuracy continuously through test correlation and model refinement

- Maintaining and coordinating multiple FEA projects done by yourself, other internal functions, as well as external partners

- Driving and reviewing FEA simulation efforts by component suppliers and ODMs

- Participating from Concept phase to provide design guidance by running FEA studies on areas of concern

- Acting as the main point of contact for all mechanical-related issues that arise from MDVT and HALT and leading issue resolution by validating design changes through simulation and/or test

- Designing and prototyping chassis and fixtures for testing

- Becoming the in-house expert in strain gauge applications and accelerometer measurements during MDVT and HALT

- Conducting thorough processing and analysis of test data including microstrain, G-levels, and ASIC temperatures throughout MDVT and HALT

- Documenting tests and FEA simulations, including static loading, modal analysis, and dynamic, in each NPI project's design review and being responsible for the system's structural integrity

- Communicating recommended design changes effectively to HW leads with strong justification backed by FEA model results

- Collaborating with ASIC development team to generate 3D models of ASICs based on package outline drawings including BGAs and conducting near-package or co-package connector placement and floorplan studies as required

- Supporting manufacturing and operations' efforts to improve production yield by performing FEA studies or running limited design of experiments in lab

- Providing mechanical design and structural analysis support across multiple product development programs, including chassis design, packaging, reliability, and manufacturability

- Participating in hands-on engineering activities, including CAD design and reviews, tolerance analysis, prototyping, testing, and root-cause investigations

- Collaborating with cross-functional teams and suppliers to identify technical risks, resolve design and manufacturing issues, and implement corrective actions

- Contributing to mechanical specifications, design guidelines, validation plans, and engineering best practices

- Providing project scoping, resource estimates, schedule input, and technical guidance for new product development efforts

Requirements:

- 10+ years of experience in electromechanical product development

- MS in Mechanical Engineering, Applied Physics, or equivalent

- Experience developing networking, server, storage, telecommunications, or high-performance computing systems

- Extensive experience with chassis development, system packaging, and high-density electronic assemblies

- Experience in FEA and familiarity with ANSYS Workbench, including static-structural, modal analysis, transient mode superposition, Eigenvalue-Buckling, and steady-state thermal

- Strong hands-on experience with tolerance analysis, GD&T, stack-up analysis, and structural analysis techniques

Expected Competencies:

- Expert-level proficiency with 3D solid modeling tools; SolidWorks experience preferred

- Working knowledge of EPDM or equivalent PLM systems is a plus

- Experience in LS-Dyna and response spectrum analysis are highly desired but not necessary

- Experience in meshing sheet metal geometries as solid or as shell elements and working knowledge of defeaturing non-structural elements to simplify mesh

- Good structural intuition of load path in a mechanical design

- Strong and proven ability to break complex system design down to a sub-system in order to simplify FEA setup and runtime

- Familiarity with test standards including GR-63, IPC-9704, and ASTM D4169

- Strong working knowledge of Young's modulus (E) and coefficients of thermal expansion (CTEs) of common materials used in ASIC and cooling components

- Experience in modeling of die warpage due to thermal effects and with heatsink loading is highly desired

- Previous training with strain gauge applications on PCB and data analysis involving principal microstrain, as well as strain rate, is highly desired

- Experience with accelerometer G-value data filtering and analysis from dynamic tests such as vibration and shock

- Proven hands-on experience in dynamic testing

- Knowledge of dye-and-pry, Shadowmoire, operation of 3D-scanning metrology equipment

- Extensive experience developing complex chassis and system-level mechanical designs for networking, server, storage, or telecommunications products

- Experience with ECAD-MCAD integration and IDF workflows

- Deep understanding of sheet metal design, machining, castings, extrusions, plastics, and associated manufacturing processes

- Strong understanding of tooling requirements and manufacturing considerations for volume production

- Strong understanding of NEBS, EMI, EMC, Safety, and other regulatory compliance requirements

- Proven ability to troubleshoot complex system-level mechanical issues in laboratory, manufacturing, and field environments

- Experience leading root-cause investigations and implementing corrective actions

- Excellent communication and leadership skills with the ability to influence cross-functional teams

- Comprehensive understanding of the complete product development lifecycle from concept through production and field support

## Skills

### Required
- Mechanical Engineering
- FEA
- ANSYS Workbench
- SolidWorks
- GD&T

### Nice to have
- LS-Dyna
- response spectrum analysis
- strain gauge applications
- accelerometer measurements

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