# Senior OSAT Manufacturing Development Engineer

**Company**: NVIDIA
**Location**: Hsinchu, Taiwan
**Experience**: senior
**Job type**: full-time
**Category**: Manufacturing
**Industry**: Technology

**Apply**: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Taiwan-Hsinchu/Senior-OSAT-Manufacturing-Development-Engineer_JR2020279?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_90a861fb-42b

## Description

NVIDIA is seeking a Senior OSAT Manufacturing Development Engineer to join their Operations team. The successful candidate will bring new products and technologies to high-volume manufacturing, drive continuous improvement in manufacturing yield, cycle time, and product quality/reliability.

Responsibilities:

- Bring new products and new technologies to high volume manufacturing

- Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability

- Address manufacturing execution and quality issues through systemic solutions

- Deliver data-driven solutions for enhanced decision making

- Manage supplier performance evaluation matrix and keep it updated based on changing business needs

- Lead change control through qualification and notification

- Lead non-conforming material disposition and problem solving

- Drive multi-sourcing materials qualifications and high volume implementation

Requirements:

- Master's degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)

- 5+ years of validated experience in Flip Chip semiconductor packaging design, process and materials development

- Direct experience in advanced assembly technologies such as 2.5D/3D packaging

- Photonics packaging experience is a plus

- Thorough understanding of chip assembly equipment design

- Extensive project management and OSAT management experience

- Strong statistical analysis skills

- Deep understanding of quality control, statistics process control, gage R&R and DOE techniques

- Knowledge of packaging industry and its supply chain

- Excellent written and oral communication skills

## Skills

### Required
- Flip Chip semiconductor packaging
- advanced assembly technologies
- statistical analysis
- quality control
- project management
- OSAT management

### Nice to have
- Photonics packaging

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Source: [Apply at nvidia.wd5.myworkdayjobs.com](https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Taiwan-Hsinchu/Senior-OSAT-Manufacturing-Development-Engineer_JR2020279?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)