# Staff Application Engineer (Electronics Thermal Management)

**Company**: Synopsys
**Location**: Irvine, California, United States
**Work arrangement**: onsite
**Experience**: staff
**Job type**: full-time
**Salary**: $112000-$168000
**Category**: Engineering
**Industry**: Technology
**Ticker**: SNPS
**Wikidata**: https://www.wikidata.org/wiki/Q2303478

**Apply**: https://careers.synopsys.com/job/irvine/staff-application-engineer-electronics-thermal-management-southern-california-13730/44408/89569494560
**Canonical**: https://yubhub.co/jobs/job_8b0622ac-0ea

## Description

Opening.

## What you'll do

Our Hardware Engineers at Synopsys are responsible for designing and developing cutting-edge semiconductor solutions. They work on intricate tasks such as chip architecture, circuit design, and verification to ensure the efficiency and reliability of semiconductor products. These engineers play a crucial role in advancing technology and enabling innovations in various industries.

Play Video![Hardware Engineering](https://tbcdn.talentbrew.com/company/44408/cms/img/ajd-overview-video-v2-m.webp)

## Job Description

**Date posted** 12/14/2025

### **Category** Engineering**Hire Type** Employee**Job ID** 13730**Base Salary Range** $112000-$168000**Remote Eligible** No**Date Posted** 12/14/2025

## What you'll do

- Lead and coordinate all technical activities throughout the sales opportunity lifecycle, including technical discovery, product presentations, demonstrations, and evaluations.

- Engage directly with customers to understand their product design needs and engineering workflows, providing expert guidance on leveraging Ansys simulation solutions for electronics thermal management.

- Develop and deploy differentiating simulation solutions using the Ansys platform, integrating them seamlessly into customer design processes.

- Serve as a subject matter expert, deepening your industry knowledge and providing guidance to both customers and internal teams.

- Collaborate with product development teams to translate customer requirements into innovative product features and best practices

- Test rigorously new Ansys product releases on real-world industrial problems and contribute to the creation of application best practices.

- Support field and digital marketing initiatives, authoring conference presentations and technical content and thought leadership within the electronics thermal domain

- Provide consulting services and conduct training classes for customers, enabling them to maximize the value of Ansys solutions.

- Travel domestically to customer sites, conferences, and industry events to provide hands-on support and build lasting relationships (up to 25%, with flexibility for up to 50%).

## What you need

- MS in Mechanical Engineering or a related field (BS+5, MS+3, or PhD+0 years of experience in engineering software environments).

- Strong background in fluid mechanics and computational fluid dynamics (CFD)and thermodynamics with practical application in the electronics industry.

- Demonstrated proficiency with Ansys software (Fluent, Icepak, Mechanical) or similar CAE, CAD, EDA, or PLM tools.

- Experience integrating simulation solutions into customer design workflows at the package, board, and system level.

- Familiarity with Multiphysics simulation approaches (e.g., Electro-Thermal, Thermo-Mechanical) is highly desirable.

- Excellent interpersonal, verbal, and written communication skills and comfort with effective interaction with senior business managers and C-level executives.

- Willingness and ability to travel domestically up to 25% (potentially up to 50%).

## Skills

### Required
- MS in Mechanical Engineering or a related field
- Strong background in fluid mechanics and computational fluid dynamics (CFD)and thermodynamics with practical application in the electronics industry
- Demonstrated proficiency with Ansys software (Fluent, Icepak, Mechanical) or similar CAE, CAD, EDA, or PLM tools

### Nice to have
- Experience integrating simulation solutions into customer design workflows at the package, board, and system level
- Familiarity with Multiphysics simulation approaches (e.g., Electro-Thermal, Thermo-Mechanical)