# (Summer Internship) Packaging Structure Design Intern

**Company**: Logitech
**Location**: Hsinchu
**Work arrangement**: onsite
**Experience**: entry
**Job type**: internship
**Category**: Design
**Industry**: Technology
**Wikidata**: https://www.wikidata.org/wiki/Q223127

**Apply**: https://logitech.wd5.myworkdayjobs.com/en-US/Logitech/job/Hsinchu-Taiwan/XMLNAME--Summer-Internship--Packaging-Structure-Design-Intern_146419?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_8b033e28-c58

## Description

## The Role and Team:

As a Packaging Structure Design Intern, you will be an active member of our global packaging and product design teams, collaborating with experts to create great products across multiple categories.

## Your Contribution:

In this role, you will gain hands-on experience in packaging structure design, materials exploration, and printing technologies. You will work alongside industry experts to bring ideas from concept to reality.

### Key Responsibilities:

- Immersive Learning: Gain hands-on experience in packaging structure design, materials exploration, and printing technologies.

- Design Systems: Contribute to packaging strategy and specification development, ensuring consistency and efficiency across global projects.

- Storytelling & Content: Craft clear, compelling stories and assets that translate design, sustainability, and innovation into clear, compelling communication for internal and external audiences.

- Material Curation: Help build and maintain our materials library,researching, sourcing, and organizing new packaging materials to support sustainable and innovative design strategies.

- Testing & Validation: Learn and apply packaging test standards to evaluate design solutions, ensuring they meet performance and quality goals.

## Key Qualifications:

To be considered for this role, you must bring the following minimum skills and experiences to our team:

- Currently an undergraduate student or within two years of graduation in Industrial Design, Packaging Design, Mechanical Engineering, or a related field.

- Fully proficient in Adobe software, ArtiosCAD and/or 3D modeling. Familiarity with Google Systems (Docs, Sheets, Drive) is essential.

- Basic understanding of packaging structure design, materials, and printing processes.

- A certain level of visual communication, multimedia production and presentation skills

- Strong English skills,both written and verbal,to collaborate effectively with global teams.

## Preferred Qualifications:

- Knowledge of packaging test standards and implementation.

- Experience with consumer electronic products is a strong plus.

- A passion for design, eagerness to learn new things and a “just do it” attitude.

## Internship Details:

- Summer internship period: July 1, 2026 (Wed) ~ August 31, 2026 (Mon) with the possibility of extension.

## Skills

### Required
- Adobe software
- ArtiosCAD
- 3D modeling
- Google Systems (Docs, Sheets, Drive)
- Packaging structure design
- Materials exploration
- Printing technologies

### Nice to have
- Packaging test standards and implementation
- Consumer electronic products
- Design
- Eagerness to learn new things
- Just do it attitude

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Source: [Apply at logitech.wd5.myworkdayjobs.com](https://logitech.wd5.myworkdayjobs.com/en-US/Logitech/job/Hsinchu-Taiwan/XMLNAME--Summer-Internship--Packaging-Structure-Design-Intern_146419?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)