# Senior Staff R&D Engineer- 3DIC

**Company**: Synopsys
**Location**: Hsinchu
**Work arrangement**: onsite
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology
**Ticker**: SNPS
**Wikidata**: https://www.wikidata.org/wiki/Q2303478

**Apply**: https://careers.synopsys.com/job/hsinchu/senior-staff-r-and-d-engineer-3dic/44408/93181375024
**Canonical**: https://yubhub.co/jobs/job_76ac3f54-125

## Description

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content.

Our Hsinchu, Taiwan site is home to a vibrant, collaborative team developing cutting-edge solutions for multi-die systems and advanced packaging. Synopsys powers breakthroughs in AI, cloud computing, 5G, IoT, and automotive, delivering industry-leading tools for chip design and software security.

### Responsibilities

- Designing, developing, and delivering software solutions for physical layout automation in advanced packaging and multi-die systems.

- Contributing to technical specifications, implementing robust and efficient code, and applying test-driven development practices.

- Debugging and resolving complex issues collaboratively, employing systematic approaches and leveraging your expertise in computational geometry.

- Ensuring software meets strict quality, performance, and reliability standards required by industry-leading customers.

- Supporting product deployment, releases, and troubleshooting customer issues to ensure seamless adoption and satisfaction.

- Collaborating with cross-functional, global teams to deliver innovative EDA solutions that advance Synopsys' technology leadership.

- Continuously learning and integrating new technologies and methodologies to enhance product capabilities and efficiency.

### Impact

- Driving innovation in physical design automation for advanced packaging, enabling the creation of high-performance, next-generation silicon chips.

- Empowering leading technology companies to accelerate their chip design cycles and achieve superior outcomes.

- Contributing to Synopsys' reputation as a pioneer in EDA solutions, strengthening our market leadership and customer trust.

- Improving software reliability and performance, directly impacting customer productivity and success.

- Facilitating the adoption of cutting-edge design methodologies and multi-die systems across the semiconductor industry.

- Mentoring and collaborating with global teammates, fostering knowledge sharing and continuous improvement.

- Enhancing the scalability and adaptability of Synopsys tools to meet evolving industry demands.

### Requirements

- Master's degree in Computer Science, Electrical Engineering, or a related field.

- 8+ years of professional software development experience, ideally within EDA or physical design/layout automation.

- Strong proficiency in C++ or other object-oriented programming languages, with solid understanding of algorithms and data structures.

- Experience with computational geometry and software development workflows/tools.

- Exceptional debugging skills and systematic problem-solving abilities.

- Proficiency in Linux; scripting experience (e.g., Tcl, Perl, or similar) preferred.

- Strong written and verbal communication skills in English (intermediate or higher).

### Who You Are

- Analytical thinker with outstanding attention to detail.

- Quick learner and self-starter, comfortable with ambiguity and change.

- Collaborative team player who thrives in diverse, global environments.

- Effective communicator who can explain complex ideas clearly to technical and non-technical audiences.

- Adaptable and resilient, able to manage multiple priorities and deadlines.

- Driven by curiosity and a passion for continuous improvement.

### Team

You'll join Synopsys' EDA Group R&D team, a dynamic, innovative group focused on developing industry-leading solutions for physical layout automation and advanced packaging. Our team collaborates across global locations, sharing expertise and driving technical excellence. We value creativity, initiative, and a commitment to delivering best-in-class software that shapes the future of chip design.

### Rewards and Benefits

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.

## Skills

### Required
- C++
- object-oriented programming
- computational geometry
- Linux
- scripting
- Tcl
- Perl