# Product Engineer - Optics Operations

**Company**: Cisco
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://cisco.wd5.myworkdayjobs.com/en-US/Cisco_Careers/job/Taipei-Taiwan/Hardware-Engineer_2025610?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_746fdfac-d0a

## Description

The Optics Operations Product Engineering team at Cisco partners with cross-functional teams to design and sustain optical transceiver components and modules throughout their product lifecycle.

As a Product Engineer, you will be responsible for taking silicon photonics wafer and chip level packaging and assembly products from New Product Introduction (NPI) to High Volume Manufacturing (HVM) release with OSAT partners.

Key responsibilities include:

- Collaborating with engineering, technology, and quality teams to characterize and optimize qualified optical packaging assembly processes

- Driving the characterization of NPI product performances and yield, including benchmark correlation to meet and/or exceed product cost targets

- Working with design teams and test engineering to stabilize and improve product screening at wafer-probe and package levels

- Reviewing and monitoring ETest/WAT data to proactively drive resolution to critical yield issues

The ideal candidate will have:

- A Master's degree minimum (PhD preferred) in Electrical Engineering, Physics, or Material Science

- 5+ years of hands-on experience in chip on wafer (CoW) and CoC (Chip on Chip) wafer processing and assembly processes

- Proven track record of transitioning products from NPI to High Volume Production at OSAT suppliers

- Strong knowledge of various wafer processing and flip chip assembly equipment

- Experience with design for manufacturability (DFM) during early product development

- Strong analytical skills and experience with troubleshooting and JMP scripting, Python, or AI models for automated yield prediction and monitoring

Desired skills include:

- Solid understanding of manufacturing processes related to semiconductor assembly and optical module manufacturing

- Experience with Cu micro bump processing and flip chip assemblies and TSV technologies

- Knowledge of post CMOS back end assembly and packaging process technologies

## Skills

### Required
- Electrical Engineering
- Physics
- Material Science
- wafer processing
- flip chip assembly
- design for manufacturability
- JMP scripting
- Python
- AI models

### Nice to have
- Cu micro bump processing
- TSV technologies
- post CMOS back end assembly and packaging process technologies

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Source: [Apply at cisco.wd5.myworkdayjobs.com](https://cisco.wd5.myworkdayjobs.com/en-US/Cisco_Careers/job/Taipei-Taiwan/Hardware-Engineer_2025610?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)