# Distinguished Signal & Power Integrity Engineer

**Company**: NVIDIA
**Location**: Santa Clara, CA
**Work arrangement**: remote
**Experience**: senior
**Job type**: full-time
**Salary**: 320,000 USD – 488,750 USD
**Category**: Engineering
**Industry**: Technology

**Apply**: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/US-CA-Santa-Clara/Distinguished-Signal-and-Power-Integrity-Engineer_JR2029411-1?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/job/distinguished-signal-and-power-integrity-engineer-634efd1b-813/

## Description

We are seeking a Distinguished Signal & Power Integrity Engineer to join our dynamic team working with state-of-the-art technology.

As a Distinguished Signal & Power Integrity Engineer at NVIDIA, you will lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors.

**Key Responsibilities:**

- Lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors.

- Oversee technical direction and implementation for next-gen products ranging from ultra-mobile to high-performance AI and HPC platforms.

- Architect and deliver state-of-the-art interconnect and packaging solutions for standards such as UCIe, HBM, DDR, PCIe, and industry-leading SerDes (224G/448G).

- Enable advanced packaging technology solutions for co-packaged optics, stacked die, chiplet-based architectures, and IVR solutions.

- Develop modeling and characterization flows, flow automations, and design for high-volume manufacturing techniques.

- Offer strategic counsel as a recognized subject matter expert to senior leadership on emerging technologies, technology investment, and research priorities in signaling, packaging, and system integration.

**Requirements:**

- 15+ years leading innovations spanning high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies.

- MS/PhD in Electrical Engineering or equivalent with 15+ years of industry experience.

- Hands-on invention and deployment of advanced solutions, e.g., EMIB, UCIe, CPO, high-density connectors.

- Deep experience with electrical, computer, and packaging engineering and deployment of such in products.

- Demonstrated ability to manage and mentor teams of highly skilled engineers, define methodologies, and deliver complex projects from research to high-volume manufacturing.

**Nice to Have:**

- An industry veteran with a proven track record of bringing advanced SI concepts from research to product.

- A known pioneer in any industry-standard high-speed signaling technology.

- Deep knowledge of operation and manufacturing challenges of package substrate, PCB, cables, and connectors.

Your base salary will be determined based on your location, experience, and other objective job-related factors. The expected base salary range for this position is 320,000 USD – 488,750 USD. You will also be eligible for equity and benefits.

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## Skills

### Required
- high-speed signal integrity
- computational electromagnetics
- semiconductor assembly technologies
- electrical engineering
- packaging engineering

### Nice to have
- EMIB
- UCIe
- CPO
- high-density connectors

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Source: [Apply at nvidia.wd5.myworkdayjobs.com](https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/US-CA-Santa-Clara/Distinguished-Signal-and-Power-Integrity-Engineer_JR2029411-1?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)