# Senior Simulation Mechanical Engineer

**Company**: NVIDIA Networking
**Location**: Yokneam
**Work arrangement**: onsite
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Israel-Yokneam/Senior-Simulation-Mechanical-Engineer_JR2017974?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_570f5edf-382

## Description

### Senior Simulation Mechanical Engineer

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locationsIsrael, Yokneam

time typeFull time

posted onPosted 5 Days Ago

job requisition idJR2017974

#### What You’ll Be Doing

Lead simulation-driven R&D efforts for next-generation data center hardware.

Perform advanced mechanical, structural, thermal, and fluid (CFD) simulations to drive design optimization.

Develop and execute experimental setups to validate simulation models through empirical testing.

Correlate simulation results with physical test data to improve model fidelity and refine boundary conditions.

Investigate reliability issues and conduct failure analyses to support robust product development.

Collaborate with cross-functional design teams while contributing hands-on to mechanical design activities.

#### What We Need to See

B.Sc. in Mechanical Engineering or higher (M.Sc. or Ph.D. preferred).

6+ years of relevant experience in an R&D environment.

Strong expertise in finite element analysis (FEA), thermal analysis, and computational fluid dynamics (CFD).

Proven experience correlating simulation results with physical testing to enhance model accuracy.

Deep proficiency with simulation tools such as Ansys (Icepak, Workbench, Mechanical, Fluent) and MATLAB.

Demonstrated ability to influence design decisions early through analytical “back-of-the-envelope” calculations and rapid modeling.

Proficiency in 3D CAD tools (Creo preferred).

Excellent written and verbal communication skills in English and Hebrew.

Self-driven, highly motivated, and capable of working both independently and as part of a team.

Strong organizational skills with the ability to manage multiple priorities in a dynamic, cross-functional environment.

#### Ways to Stand Out from the Crowd

Expertise in electronics cooling and packaging, including thermal interface materials (TIMs), heat sink optimization, and liquid cooling systems (cold plates, manifolds, CDUs).

Strong understanding of structural dynamics, including shock and vibration standards for high-density server environments.

Advanced CAD capabilities (e.g., Creo, SolidWorks, NX), including model preparation for simulation (simplification, defeaturing, mid-surfacing).

Background in global enterprise telecommunications organizations and experience developing and implementing new design methodologies.

Familiarity with AI tools for mechanical design, simulation, and debugging.

## Skills

### Required
- finite element analysis (FEA)
- thermal analysis
- computational fluid dynamics (CFD)
- Ansys (Icepak, Workbench, Mechanical, Fluent)
- MATLAB
- 3D CAD tools (Creo)
- English
- Hebrew

### Nice to have
- electronics cooling and packaging
- thermal interface materials (TIMs)
- heat sink optimization
- liquid cooling systems (cold plates, manifolds, CDUs)
- structural dynamics
- shock and vibration standards
- advanced CAD capabilities (e.g., Creo, SolidWorks, NX)
- model preparation for simulation (simplification, defeaturing, mid-surfacing)
- global enterprise telecommunications organizations
- new design methodologies
- AI tools for mechanical design, simulation, and debugging

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