# Packaging and Manufacturability Lead

**Company**: NVIDIA
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Israel-Tel-Aviv/Principal-Engineer--Package-Integration-and-Manufacturability_JR2028378?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_54b066e1-e77

## Description

We are seeking an experienced packaging, technology, and manufacturability expert to help us build the next generation of networking products. As a Packaging and Manufacturability Lead, you will own the package technical view across our chip programs, partnering with the advanced technology group to push technology limits in future products.

**Key Responsibilities:**

- Lead the technical assessment of package risk across our chip programs, identifying failure modes in substrate, interposer, and assembly integration before they reach silicon

- Drive new approaches to manufacturability across the board, spanning yield improvement, capacity and supply review, test strategy, thermal and assembly process maturity

- Analyze module yield mechanics, reconcile predicted versus actual yield on units returning from assembly, and convert the findings into concrete design guidance

- Evaluate emerging packaging and photonics technologies, including outside partner solutions, and define our product requirements

**Requirements:**

- B.S or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science or equivalent experience

- More than 15 years of experience in package technology development or system integration, with multiple products carried through assembly

- Deep understanding of 2.5D, chiplet, and organic substrate integration

- Strong analytic capabilities, and passion for solving demanding technical problems

- Ability to drive complex activities involving many interfaces and teams, and to hold a technical position across organizations

**Nice to Have:**

- Hands-on experience on an assembly floor, a foundry, or at an OSAT

- Experience with co-packaged optics, photonic packaging, or fiber and laser attach

- Proven experience driving design-for-manufacturability into early architecture decisions

- Familiar with working on large high-end ASICs and multi-die modules

NVIDIA offers highly competitive salaries and a comprehensive benefits package.

## Skills

### Required
- Electrical Engineering
- Mechanical Engineering
- Materials Science
- 2.5D integration
- chiplet integration
- organic substrate integration
- assembly and module yield mechanics
- analytic capabilities

### Nice to have
- co-packaged optics
- photonics packaging
- fiber and laser attach
- design-for-manufacturability

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Source: [Apply at nvidia.wd5.myworkdayjobs.com](https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Israel-Tel-Aviv/Principal-Engineer--Package-Integration-and-Manufacturability_JR2028378?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)