# Senior Package Engineer

**Company**: NVIDIA
**Location**: Yokneam, Israel
**Experience**: senior
**Job type**: full-time
**Category**: Engineering
**Industry**: Technology

**Apply**: https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Israel-Yokneam/Senior-IC-Packaging-Process-Engineer_JR2028291?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_53c8b2e6-0ef

## Description

As a Senior Package Engineer at NVIDIA, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages.

Responsibilities:

- Lead adhesive and bonding process development for advanced FCBGA packaging, including surface preparation, surface coatings, and process optimization for applications requiring optical alignment and high dimensional stability.

- Design and execute Design of Experiments (DOE) for adhesive material qualification, process window definition, and process optimization including failure analysis.

- Evaluate and qualify new materials (adhesives, encapsulants, underfills) from vendors including characterization of cure chemistry, thermal stability, and mechanical properties.

- Define and own incoming material acceptance criteria and statistical process control (SPC) thresholds for production readiness.

- Collaborate with partners and material suppliers to resolve process escapes, drive 8D corrective actions, and align on specification requirements.

- Prepare process documentation, assembly specs, and material qualification reports.

- Monitor and analyze production data to identify process trends, drive yield improvements, and ensure ongoing process control across OSAT manufacturing sites.

Requirements:

- B.Sc. or M.Sc. in Materials Science, Chemical Engineering, or a related field.

- 7+ years of experience in process engineering, with hands-on expertise in adhesive process development.

- Proven experience with failure analysis techniques: cross-sectioning, SEM/EDX, optical microscopy, DSC, TGA, and FTIR.

- Willingness and ability to travel internationally approximately 30% of the time to support OSAT partners, supplier qualifications, and on-site failure investigations.

- Ability to work independently in a fast-paced, multi-program environment.

- Curious and creative problem solver as well as organized and multi-tasker.

- Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written).

- High awareness of quality, manufacturability, and project schedule.

Nice to Have:

- Proven record in packaging development.

- Background in semiconductor manufacturing processes and optical systems.

## Skills

### Required
- Materials Science
- Chemical Engineering
- adhesive process development
- failure analysis
- SEM/EDX
- optical microscopy
- DSC
- TGA
- FTIR

### Nice to have
- packaging development
- semiconductor manufacturing processes
- optical systems

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Source: [Apply at nvidia.wd5.myworkdayjobs.com](https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/Israel-Yokneam/Senior-IC-Packaging-Process-Engineer_JR2028291?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)