# Executive Director of R&D Engineering for 3DIC-Advance Packaging

**Company**: Synopsys
**Location**: Sunnyvale, California
**Work arrangement**: onsite
**Experience**: executive
**Job type**: full-time
**Salary**: $268,000-$402,000
**Category**: Engineering
**Industry**: Technology
**Ticker**: SNPS
**Wikidata**: https://www.wikidata.org/wiki/Q2303478

**Apply**: https://careers.synopsys.com/job/sunnyvale/executive-director-of-r-and-d-engineering-for-3dic-advance-packaging/44408/96193430240?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_40a447a9-94a

## Description

We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

You are a seasoned semiconductor leader with deep expertise in IC design and advanced packaging, including 3DIC technologies. You have successfully led complex, cross-functional organisations and delivered differentiated silicon IP solutions from concept to execution.

You bring a strong strategic mindset, combining technical depth with a clear understanding of market dynamics and customer needs. You are known for translating complex technical challenges into actionable plans and for influencing across engineering, product, go-to-market, and customer-facing teams in a highly matrixed, global environment.

You inspire, develop, and empower high-performing teams. You foster a culture of collaboration, accountability, and continuous improvement, and you lead with credibility, clarity, and purpose to consistently exceed business and customer expectations.

What You'll Be Doing:

- Leading 3DIC silicon IP and advanced packaging design and verification across layout, physical design, signal integrity, power integrity, thermal modelling management, and mechanical integrity for AI infrastructure and high-performance computing products.

- Managing cross-functional collaboration with EDA tool development, Go-To-Market strategies, and Customer Success in utilizing Synopsys solutions.

- Keeping track of industry trends in the fast-changing field of 3DIC and semiconductor packaging to drive new product innovations.

- Ensuring developed solutions are in alignment with business objectives while delivering differentiated technical solutions.

- Embodying a collaborative, supportive, and inspirational leadership style to deliver results that exceed expectations.

- Comfortable in a matrixed, international, team-oriented environment with multiple stakeholders.

The Impact You Will Have:

- Driving the strategic technology development, planning, and execution of Silicon IP for 3DIC and advanced packaging solutions.

- Influencing and shaping the direction of Synopsys' product offerings in the semiconductor industry.

- Playing a key role in advancing Synopsys' 3DIC and advanced packaging leadership by contributing to the company's long-term technology roadmap.

- Enhancing customer satisfaction by delivering state-of-the-art solutions that meet their needs.

- Contributing to the overall success and growth of Synopsys by leading high-impact projects.

- Fostering a culture of excellence and continuous improvement within your team.

What You'll Need:

?B.S./M.S. in Electrical Engineering or a related technical discipline, or equivalent professional experience.

- 15+ years of experience in the semiconductor industry, with demonstrated depth in advanced packaging and 3DIC technologies.

- Deep hands-on and organisational expertise in 3DIC architectures, including chiplets, heterogeneous integration, and die-to-die interconnects.

- Strong command of 3DIC-specific design and signoff challenges, including signal and power integrity, thermal behaviour, mechanical stress, reliability, and yield.

- Experience building, leading, and scaling large, multi-site engineering teams, delivering complex 3DIC technologies from architecture through production.

- Ability to drive end-to-end silicon IP execution, making sound tradeoffs across performance, power, area, cost, and manufacturability.

- Capability to define technical vision and long-term roadmap for 3DIC and advanced packaging, aligned with business strategy.

- Effectiveness in influencing across functions, partnering with EDA, product management, go-to-market, manufacturing, and customer success teams in a matrixed environment.

- Strong customer-facing leadership, including direct engagement with leading customers and ecosystem partners to shape requirements and drive adoption.

- A customer-centric mindset, strong execution discipline, and commitment to innovation and continuous improvement.

## Skills

### Required
- 3DIC technologies
- IC design
- Advanced packaging
- Electrical Engineering
- Technical leadership
- Strategic planning
- Cross-functional collaboration
- Project management
- Silicon IP design and verification
- Signal integrity
- Power integrity
- Thermal modelling management
- Mechanical integrity

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Source: [Apply at careers.synopsys.com](https://careers.synopsys.com/job/sunnyvale/executive-director-of-r-and-d-engineering-for-3dic-advance-packaging/44408/96193430240?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)