# Leader, Thermal Hardware Engineering

**Company**: Cisco
**Location**: San Jose, California
**Work arrangement**: onsite
**Experience**: senior
**Job type**: full-time
**Salary**: $194,600.00 to $285,700.00
**Category**: Engineering
**Industry**: Technology

**Apply**: https://cisco.wd5.myworkdayjobs.com/en-US/Cisco_Careers/job/San-Jose-California-US/Leader--Hardware-Engineering_2015094-1?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_31493048-13c

## Description

You will join the Component Quality & Technology Group within Global Supply Chain Operations at Cisco. Our team is at the forefront of technical innovation, responsible for the roadmap, development, and implementation of sophisticated end-to-end thermal solutions that power Cisco's world-class products.

**Your Impact** You will collaborate extensively with Business Units, Product Operations, Manufacturing, Planning, and Supplier Management. You will also represent Cisco in external industry forums, conferences, and academic partnerships to adopt cutting-edge technologies that keep Cisco ahead of the competition.

**Key Responsibilities:**

- Strategic Leadership: Lead a global team of thermal component engineers, fostering a culture of technical excellence, mentorship, and career development.

- Technology Roadmap: Partner with microelectronics packaging suppliers, thermal interface material (TIM) vendors, and internal stakeholders to define and execute a system-wide thermal technology roadmap.

- Ecosystem Readiness: Drive supply ecosystem readiness for advanced cooling technologies, including liquid and immersion cooling.

- Innovation & Strategy: Investigate innovative, large-scale thermal cooling solutions. Develop commodity and supplier strategies based on industry sensing, quality roadmaps, and rigorous supplier assessments.

- Quality Excellence: Establish and maintain an end-to-end quality strategy for all thermal components.

- Technical Analysis: Analyze thermal performance tradeoffs (substrate, underfill, TIM, heat spreaders) and chip thermal gradients using experimental test data.

- Validation & Qualification: Define test plans and qualification requirements for mechanical and manufacturing adaptability (pumps, heat pipes, vapor chambers, heat sinks, liquid cooling).

- Industry Influence: Engage with ODMs and component vendors, participate in industry consortia, and collaborate with academia to influence Cisco's position as an industry leader.

**Minimum Qualifications:**

- BS in Mechanical, Thermal, or Chemical Engineering or a related field.

- 10+ years of experience in the design, simulation, testing of thermal solutions for electronic devices and systems.

- Extensive experience with advanced air-cooling technologies (vapor chambers, remote heat sinks, TIM, fan trays).

- Experience with liquid cooling and/or immersion cooling.

- Proven people leadership experience.

**Preferred Qualifications:**

- MS or PhD in Mechanical or Chemical Engineering or a related field.

- 15+ years of relevant experience in microelectronics thermal cooling; 10+ years of people leadership experience.

- Expertise in Thermal Interface Material (TIM) conductivity testing procedures and microelectronics packaging manufacturing processes.

**Benefits:**

- Medical, dental and vision insurance

- 401(k) plan with a Cisco matching contribution

- Paid parental leave

- Short and long-term disability coverage

- Basic life insurance

- Paid time away (10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees, 1 paid day off for employee's birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness)

- Flexible vacation time off program

- Sick time off

- Optional 10 paid days per full calendar year to volunteer

## Skills

### Required
- Thermal Hardware Engineering
- Mechanical Engineering
- Thermal Engineering
- Chemical Engineering
- Leadership
- Thermal Interface Material (TIM)
- Microelectronics Packaging

### Nice to have
- MS or PhD in Mechanical or Chemical Engineering
- Thermal Interface Material (TIM) conductivity testing procedures
- Microelectronics packaging manufacturing processes

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Source: [Apply at cisco.wd5.myworkdayjobs.com](https://cisco.wd5.myworkdayjobs.com/en-US/Cisco_Careers/job/San-Jose-California-US/Leader--Hardware-Engineering_2015094-1?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)