# Thermal Associate Engineer (Fall 2026)

**Company**: Astranis
**Location**: San Francisco
**Work arrangement**: onsite
**Experience**: entry
**Job type**: internship
**Salary**: $19,250
**Category**: Engineering
**Industry**: Technology
**Wikidata**: https://www.wikidata.org/wiki/Q96372482

**Apply**: https://job-boards.greenhouse.io/astranis/jobs/4604258006?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply
**Canonical**: https://yubhub.co/jobs/job_209b88b4-4ab

## Description

We are seeking a Thermal Associate Engineer to join our team in San Francisco. As a Thermal Associate Engineer, you will work together with the engineering team to design, analyze, build, and test satellite hardware and/or software. You will support design trades that successfully balance performance margins, resource use, risk, cost, and schedule. You will perform thermal analysis to varying degrees of fidelity on a variety of different types of hardware such as propulsion components, batteries, high-powered electronics, RF components, mechanisms, and printed circuit boards (PCBs).

You will design, evaluate, procure, and test thermal solutions such as heaters, heat pipes, thermal interface materials, and surface coatings. You will develop processes and procedures for integration and assembly which ensure thermal design intent is met. You will collaborate with the integration and test team in the installation of thermal hardware as needed. You will plan and run thermal vacuum testing and verification at the component and spacecraft level.

Requirements:

- Have a four-year degree in mechanical, aerospace, or equivalent technical degree (e.g., physics or applied math)

- A passion and enthusiasm for hardware development, including working in a fast-paced environment and hands-on design and development

- Demonstrated ability to personally design, build, and test hardware from scratch

Bonus:

- Experience with CAD

- Experience with analytical software thermal analysis such as ANSYS and Thermal Desktop

- Experience with electronics systems design and packaging

- Experience (projects or previous internships) related to aerospace

The base salary for this position is $1,925 per week.

## Skills

### Required
- thermal analysis
- hardware development
- mechanical engineering
- aerospace engineering
- physics
- applied math

### Nice to have
- CAD
- ANSYS
- Thermal Desktop
- electronics systems design
- packaging

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Source: [Apply at job-boards.greenhouse.io](https://job-boards.greenhouse.io/astranis/jobs/4604258006?utm_source=yubhub.co&utm_medium=jobs_feed&utm_campaign=apply)